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for further information contact your local stmicroelectronics sales office. february 2014 docid025032 rev 3 1/12 EV-VNH5180A vnh5180a evaluation board data brief features ? simple single ic application board dedicated for vnh5180-e ? provides thermal heat-sinking for ease of use in prototyping ? provides electrical connectivity for easy prototyping description EV-VNH5180A provides you an easy way to connect st?s surface mounted vipower ? h-bridge drivers into your existing prototype circuitry. this evaluation board comes preassembled with vnh5180a-e h-bridge. the vnh5180a-e is a system in package h-bridge manufactured in the st proprietary vipower m0- 5 technology and housed in the powersso-36 package. the vnh5180a-e is designed to drive 12 v automotive bidirectional load such as a pmdc motor. the vnh5180a-e provides protection, diagnostics and easy 3 v and 5 v cmos-compatible interface with any microcontroller. the device integrates advanced protection functions such as load current limitation, inrush and active overload management by power limitation, overtemperature shut-off with autorestart and overvoltage active clamp. a dedicated analog current sense pin is associated with every output channel in order to provide enhanced diagnostic functions including fast detection of overload and short-circuit to ground through power limitation indication, overtemperature indication, short-circuit to v cc protection and diagnosis as well as on-state and off-state open-load detection.the current sensing and diagnostic feedback of the whole device can be disabled by pulling the cs_dis pin high to allow sharing of the external sense resistor with other similar devices. parameter symbol value unit max supply voltage v cc 41 v operating voltage range v cc 5.5 to 18 v max on-state resistance (per leg) r on 50 m ? high-side current limitation (typ) i umh 42 a off-state supply current i s 3a table 1. device summary order codes reference ev-vnh5180 EV-VNH5180A evaluation board www.st.com
contents EV-VNH5180A 2/12 docid025032 rev 3 contents 1 design recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 board connector reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.1 ecopack ? packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 appendix a reference documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
docid025032 rev 3 3/12 EV-VNH5180A list of tables 3 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. vnh5180a thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. pcb specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 4. board connector specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 5. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
list of figures EV-VNH5180A 4/12 docid025032 rev 3 list of figures figure 1. vnh5180a evaluation board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. board layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
docid025032 rev 3 5/12 EV-VNH5180A design recommendations 11 1 design recommendations this evaluation board provides mounting and some heat sinking capability for prototype development, but there are still external components that are required to make these devices work in any application. figure 1 illustrates the necessary components for any application. figure 1. vnh5180a evaluation board please note that the high side drains and the low side sources are not tied together internally. to make the h-bridge the source_hsa pins must be electr ically connected to the drain_lsa pins. the same applies for the source_hsb and drain_lsb pins. st has produced a user manual for safe designs using st?s vipower devices. this is um1556 (see section appendix a: reference documents ). um1556 is a vipower hardware design guide that provides all of the necessary information to successfully design your circuit using our vipower drivers. all designs have different needs and requirements. whatever design you decide to use you will still need to verify that it meets your application needs. st implies no guarantee or warranty (see section appendix a: reference documents ). gnd_a source_hsa vcc ina ena/diaga in_pwm source_hsb nc enb/diagb inb vcc drain_lsa dra in _ ls a dra in _ ls b cs_dis cs gnd_b drain_lsb drain_lsa 10k 10k 10k 10k vcc ( ba t t e r y ) 10k 10k 10k 10k in a in_pwm in b enb/diagb cs_ di s 10k 10k rsense cs to load 10k ena/diaga 10k EV-VNH5180A gnd_a gnd_a source_hsa source_hsa source_hsa source_hsa gnd_b gnd_b gnd_b gnd_b gnd_b drain_lsb source_hsb source_hsb source_hsb vcc source_hsb enb/diagb to load ena/diaga gnd_a gnd_a gnd_a
thermal data EV-VNH5180A 6/12 docid025032 rev 3 2 thermal data table 2. vnh5180a thermal data symbol parameter max. value unit r thj-amb hsd thermal resistance junction-ambient (max) 31 c/w r thj-amb lsd thermal resistance junction-ambient (max) 40 c/w table 3. pcb specifications parameter value unit board dimensions 51 x 58 mm number of cu layer 2 ? layer cu thickness 70 m board finish thickness 1.6 +/- 10% mm board material fr4 ? thermal vias separation 1.2 mm thermal vias diameter 0.3 +/- 0.08 mm
docid025032 rev 3 7/12 EV-VNH5180A board connector reference 11 3 board connector reference figure 2. board layout table 4. board connector specification connector board lead number device pin function (1) j1 1 gnd_a j1 2 drain_lsa j1 3 gnd_a j1 4 gnd_a j1 5 gnd_a j1 6 gnd_a j1 7 gnd_a j1 8 drain_lsa j1 9 source_hsa j1 10 source_hsa j1 11 source_hsa j1 12 source_hsa j1 13 v cc j1 14 source_hsa j1 15 ina j1 16 ena/diaga
board connector reference EV-VNH5180A 8/12 docid025032 rev 3 j1 17 in_pwm j1 18 nc j1 v cc v cc j2 v cc v cc j2 19 cs j2 20 cs_dis j2 21 enb/diagb j2 22 inb j2 23 source_hsb j2 24 v cc j2 25 source_hsb j2 26 source_hsb j2 27 source_hsb j2 28 source_hsb j2 29 drain_lsb j2 30 gnd_b j2 31 gnd_b j2 32 gnd_b j2 33 gnd_b j2 34 gnd_b j2 35 drain_lsb j2 36 gnd_b 1. for further clarification on pin functions please refer to the related datasheet (see appendix a: reference documents ). table 4. board connector specification (continued) connector board lead number device pin function (1)
docid025032 rev 3 9/12 EV-VNH5180A package information 11 4 package information 4.1 ecopack ? packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark.
reference documents EV-VNH5180A 10/12 docid025032 rev 3 appendix a reference documents ? vipower m0-5 and m0-5enhanced high-side drivers (um1556, docid 023520) ? evaluation product licence agreement on www.st.com
docid025032 rev 3 11/12 EV-VNH5180A revision history 11 revision history table 5. document revision history date revision changes 29-jul-2013 1 initial release. 17-sep-2013 2 updated disclaimer. 11-feb-2014 3 updated description .
EV-VNH5180A 12/12 docid025032 rev 3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com

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